LUXBEAM Lithography System
The LUXBEAM LITHOGRAPHY SYSTEM (LLS)* is a DLP based lithography system designed for direct imaging of PCB’s and other lithography applications.
A sub system for machine builders
The LLS is a sub system for machine builders to incorporate into their new direct imaging lithography machines. The system comes with a detailed documented interface and on-site support for easy integration into the machine base and machine SW. The LLS supports two main market segments.
LLS 10 with line/space/dam capabilities of 8–10 μm for PCB applications.
LLS 25 with line/space/dam capabilities of 20 μm PCB applications.
LLS 30 with line/space/dam capabilities of 30 μm for PCB applications.
They all utilise a very powerful and compact multi LED light source covering the range from
350–440 nm. The power level and data handling meets the state of the art requirements for
high throughput machines.
Advanced packaging / Semicon back end market:
LLS 2500 with line/space capabilities of 2–3 μm for wafer (FOWLP*) and panel (FOPLP**) packaging and wafer back end applications.
LS 04 with line/space capabilities of 3-5 μm for wafer (FOWLP) and panel (FOPLP) packaging and wafer back end applications.
LLS 10 with line/space capabilities of 8–10 μm for wafer (FOWLP) and panel (FOPLP) packaging and wafer back end applications.
LLS 2500 and LLS 04 utilises a high power 405 nm laser light source for maximum optical power efficiency and image quality. The power level and data handling meets the state of the art requirements for high throughput machines.
* Fan-out wafer level packaging
** Fan-out panel level packaging
The LLS2500 supports a Direct Imaging Machine with capabilities of 2 μm line/space.
The LLS04 supports a Direct Imaging Machine with capabilities of 4 μm line/space.
The LLS10 supports a Direct Imaging machine with capabilities of 10 μm line/space.
The LLS25 supports a Direct Imaging machine with capabilities of 20 μm line/space.
The LLS30 will support a Direct Imaging machine with capabilities of 30 μm line/space.
High throughput capability
The high UV power in the image in combination with high data throughput, real time image processing and high frame rate DLP technology is capable of supporting machine configurations with state of the art throughput.
10 GBit Ethernet lines
The exposure job is stored in the photo head prior to start of a production batch. Multiple jobs can be stored at the same time. This is an advantage compared to systems which load data to the photo head continously while exposing. Hence, potential image data transfer errors and time consuming retransmissions are eliminated. The LLS photo head does all the real time processing (warping ,scaling etc) internally. Nevertheless the LLS has a high speed 10 Gbit interface for loading compressed data into the photo head. The result is that new jobs are loaded very fast.
Processing and real time scaling and warping
The LLS converts artwork data in an offline preprocessing PC.
The LLS preprocessing SW supports Gerber, ODB++, Oasis, and GDS II formats.
The processed data for new panel job(s) is transferred to the photo heads within seconds. The scaling and warping according to the selected “recipe” is done in real time, while printing, with start of printing only within a few tenths of a second after the registration data is available. This supports highly automated multi-table solutions where registration can be done in parallel with printing, enabling state of the art throughput.
Autofocus and tracking
Due to panels not being completely flat, Visitech has developed a real time autofocus and tracking system with a Z motion reference design. The autofocus functionality will enable flawless printing on panels that are not flat. Two modes of autofocus modes are supported to cope with inner layer, outer layer and soldermask applications in addition to wafers and very reflective surfaces.
Low maintenance cost
DLP, LED technology and laser diodes as light source provides a system with superior lifetime and very low maintenance cost compared to conventional lasers.
Multi UV LED light source
The LLS30, LLS25 and LLS10 photo heads includes a multi UV LED light source with a range from 350 nm to 440 nm with high UV energy output in combination with high depth of focus. This enables the LLS to be used in inner / outer layer as well as for solder mask application.
Laser diode light source
The LLS04 and LLS2500 comes with a high power 405 nm laser diode light source.
SWAP & GO light source replacement with auto calibration
The multi LED / laser light source module can be extracted easily from the photo head to be placed on a maintenance desk for easy LED / laser module SWAP by the end user operator. The LED / laser module contains measured LED / laser data such that the system will automatically self-calibrate after replacement the system will automatically self-calibrate. This ensures that all photo heads have equal power per wavelength at all times.
This function enables the machine end user to do on-site exchanges without need for external service personnel.
The LLS is based on the patented optical multiplexing technology, creating the optical performance and environment that enables sub-pixelation (SPX) during motion.
Pixel power control*
The image from the LLS photo head will go through the Pixel Power Control (PPC), making sure that every subpixel in the resin will «receive» the same amount of UV power.
The optical multiplexing and high resolution in the LLS is challenging optical performance and assembly. Visitech has developed assembly techniques enabling optical element assembly with μm accuracy.
Our reference LLS lithography stages / machines are available for demonstration and test exposure of PCB/wafer (and other materials) samples for evaluation of performance and throughput.
Internal registration camera*
For fine line applications like advanced packaging, i.e. FOWLP and FOPLP, high accuracy registration is needed. Typically registration accuracy below 1 μm is required. This is a real challenge to achieve, purely due to opto-mechanical physics. The LLS2500 and LLS04 has a build in camera that is sharing the optomechanical structure with the photo head, including the projection lens. This structure enables highest possible registration accuracy.
Further this internal camera system can be used to calibrate external registration camera systems mounted in the same machine, which does not share optomechanical system with the photo head.
(*) Patented and patents pending.