Visitech is committed to the AM market development and has invested heavily in R&D and manufacturing capacity.
Although 3D printing technology has been around for decades, the availability of strong and durable materials has been the culprit — limiting the market.
The development of new materials and print processes has converted 3D printing into Additive Manufacturing (AM); the manufacturing of real, usable parts in medium- to high volumee, made of plastics, ceramics and metals.
Designers using modern CAD-tools and 3D design shape the most creative forms and design. Reproduction of such advanced designs may only be possible using Additive Manufacturing.
A greener choice
An added bonus is that AM is environmentally friendly. Material waste is scarce, compared to traditional machining of parts from material blocks.
We can configure our patented, scalable and modular LUXBEAM® Rapid System UV and IR light engines to suit your requirements for wavelengths, pixel sizes, building areas, and throughput.
Fewer building area limitations
Additionally, we offer sub-systems, enabling you to build high-resolution printing machines combined with vast building areas. Our systems contain light engines, control software, and ready-to-use infrastructure, such as calibration cameras, motion systems, etc. Our customers can build real AM machines quickly, with low risk and short time-to-market.
By our LUXBEAM® Lithography system, we offer a proven product that supports fine-line applications and manufacturing of energy-efficient electronics.
The consumer electronics market constantly demands smaller and smaller devices, that are less power-demanding, while outputting higher and higher computing power – as seen in mobile phones, smart watches and IOT.
For PCB (Printed Circuit Boards), the introduction of direct imaging lithography has replaced conventional exposure machines, coping with increasing accuracy requirements, slimmer linewidth and smaller space for the conducting material.
There is a high cost for the semiconductor industry to produce slimmer and slimmer lines to include extended functionality in the same die (ref. Moore´s law). The answer to this is advanced packaging, where multiple dies are interconnected, such as System in Package (SiP).
Advanced packaging configurations, such as FOPLP, and FOWLP with SiP, create challenges for the fabricators´ manufacturing process in keeping up high yield.
The SiP-approach must cope with challenges, such as die shift and rotation, and printing the connecting traces from a shifted and rotated unit toward a fixed routing on a panel or wafer. To compensate for these effects, registration and smart warping of the artwork is required.
Large measurement tools are used to measure all dies, and their positions, and thereafter a new layout is calculated and made. The entire process is for that particular panel only. A costly and time-consuming process, prior to the stepper lithography tool, that can print these new lines in the routing.
By introducing Direct imaging Lithography, the warping of the artwork can be done in real-time, milliseconds after the registration is performed. Further features, such as panel data with incremental serial number labelling, is available.
Visitech has extensive experience with direct imaging lithography. The LUXBEAM® Lithography System (LLS) is available for advanced packaging toolmakers, to design tools meeting state-of-the-art, 2 or 4µm line/space requirements.
Ready to scale up your production?
With Visitech inside we enable your production to be more precise and cost-effective.
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