Visitech is committed to developing the Additive Manufacturing market and has invested heavily in R&D and manufacturing capacity.
Although 3D printing technology has been around for decades, the availability of strong and durable materials has been the culprit — limiting the market.
The development of new materials and print processes has converted 3D printing into Additive Manufacturing (AM); the manufacturing of real, usable parts in medium- to high volume, made of plastics, ceramics, and metals.
Designers using modern CAD and 3D design tools shape the most creative forms and designs. Reproduction of such advanced designs may only be possible using additive manufacturing.
A greener choice
A bonus is that additive manufacturing is environmentally friendly. Material waste is scarce compared to traditional machining of parts from material blocks.
We can configure our patented, scalable, and modular LUXBEAM® Rapid System UV and IR light engines to suit your requirements for wavelengths, pixel sizes, building areas, and throughput.
Fewer building area limitations
Additionally, we offer subsystems that enable you to build high-resolution printing machines combined with vast building areas. Our systems contain light engines, control software, and ready-to-use infrastructure, such as calibration cameras and motion systems. Our customers can build real AM machines quickly, with low risk and short time-to-market.
With our LUXBEAM® Lithography system, we offer a proven product that supports fine-line applications and the manufacturing of energy-efficient electronics.
The consumer electronics market is in constant demand for smaller and smaller devices that consume less power while outputting higher and higher computing power – as seen in mobile phones, smartwatches, and IOT.
For PCB (Printed Circuit Boards), direct imaging lithography’s introduction has replaced conventional exposure machines, coping with increasing accuracy requirements, slimmer linewidth, and smaller space for the conducting material.
There is a high cost for the semiconductor industry to produce slimmer and slimmer lines to include extended functionality in the same die (ref. Moore’s law). The answer to this is advanced packaging, where multiple dies are interconnected, such as System in Package (SiP).
Advanced packaging configurations, such as FOPLP, and FOWLP with SiP, create challenges for the fabricators’ manufacturing processes in keeping up sufficient yield.
The SiP-approach must cope with challenges such as die shift and rotation, and printing the connecting traces from a shifted and rotated unit toward a fixed routing on a panel or wafer. To compensate for these effects, registration and smart warping of the artwork is required.
Large measurement tools are used to measure all dies and their positions, and thereafter a new layout is calculated and made. The entire process is for that particular panel only – a costly and time-consuming process, prior to the stepper lithography tool, that can print these new lines in the routing.
By introducing direct imaging lithography, the warping of the artwork can be done in real-time, milliseconds after the registration is performed. Further features, such as panel data with incremental serial number labelling, is available.
Visitech has extensive experience with direct imaging lithography. The LUXBEAM® Lithography System (LLS) is available for advanced packaging toolmakers to design tools meeting state-of-the-art 2 or 4 µm line/space requirements.
Ready to scale up your production?
With Visitech inside we enable your production to be more precise and cost-effective.
Necessary cookies are absolutely essential for the website to function properly. This category only includes cookies that ensures basic functionalities and security features of the website. These cookies do not store any personal information.
Any cookies that may not be particularly necessary for the website to function and is used specifically to collect user personal data via analytics, ads, other embedded contents are termed as non-necessary cookies. It is mandatory to procure user consent prior to running these cookies on your website.
Analytical cookies are used to understand how visitors interact with the website. These cookies help provide information on metrics the number of visitors, bounce rate, traffic source, etc.
The _ga cookie, installed by Google Analytics, calculates visitor, session and campaign data and also keeps track of site usage for the site's analytics report. The cookie stores information anonymously and assigns a randomly generated number to recognize unique visitors.
This cookie is installed by Google Analytics.
A variation of the _gat cookie set by Google Analytics and Google Tag Manager to allow website owners to track visitor behaviour and measure site performance. The pattern element in the name contains the unique identity number of the account or website it relates to.
Installed by Google Analytics, _gid cookie stores information on how visitors use a website, while also creating an analytics report of the website's performance. Some of the data that are collected include the number of visitors, their source, and the pages they visit anonymously.
Hotjar sets this cookie to detect the first pageview session of a user. This is a True/False flag set by the cookie.
Hotjar sets this cookie to identify a new user’s first session. It stores a true/false value, indicating whether it was the first time Hotjar saw this user.
Hotjar sets this cookie to know whether a user is included in the data sampling defined by the site's pageview limit.
Hotjar sets this cookie to know whether a user is included in the data sampling defined by the site's daily session limit.