Meet us at stall 439 at Semicon West 2021 in San Francisco, USA, December 7-9, 2021!
Discover our LUXBEAM Lithography System (LLS) products for Semicon applications. Our photo head and software subsystem technology offers superior flexibility and cost of ownership in comparison to conventional stepper technology. In addition, it is fully compatible and field-proven. Applications like FOPLP, FOWLP are supported using System in Package (SiP) and System on Chip (SoC), and other advanced packaging methods. Our technology offers industrial high throughput Direct Imaging systems from 2,5µm to 6µm Line/Space for Semicon and Fineline applications built on 20 years of expertise with DLP technologies.
Meet our team or pre-book a meeting with us for more information!