DLP® technology allows conventional mask exposure lithography to be replaced with Direct Imaging (DI) where the DMD provides the UV light to be directed to the areas to be exposed.
Save time and cost with higher accuracy
Direct Imaging provides higher accuracy and enables thinner lines/space for inner/outer layer and solder mask, in addition to saving cost and time in manufacturing.
In addition, Direct Imaging enables scaling, warping based on registration data from the panel, as well as effortless revision change of printing content.
VISITECH’s LUXBEAM Lithography System (LLS) is a sub-system for PCB Direct Imaging machines.
The LLS2500 supports a Direct Imaging Machine with capabilities of 2 um line/space.
The LLS04 supports a Direct Imaging Machine with capabilities of 4 um line/space.
The LLS10 supports a Direct Imaging machine with capabilities of 10 um line/space.
The LLS25 supports a Direct Imaging machine with capabilities of 20 um line/space.
The LLS30 will support a Direct Imaging machine with capabilities of 30 um line/space.